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翻訳と辞書　辞書検索 [ 開発暫定版 ] スポンサード リンク Bow and warp of semiconductor wafers and substrates ： ウィキペディア英語版 Bow and warp of semiconductor wafers and substrates Bow and warp of semiconductor wafers and substrates are measures of the flatness of wafers. ==Definitions== Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the median surface to the reference plane. Where the reference plane is defined by three corners of equilateral triangle. This definition is based on now obsolete ASTM F534.〔http://www.astm.org/Standards/F534.htm〕 Warp is the difference between the maximum and the minimum distances of the median surface of a free, un-clamped wafer from the reference plane defined above. This definition follows ASTM F657,〔http://www.astm.org/Standards/F657.htm〕 and ASTM F1390.〔http://www.astm.org/F1390.htm〕 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Bow and warp of semiconductor wafers and substrates」の詳細全文を読む スポンサード リンク 翻訳と辞書 : 翻訳のためのインターネットリソース Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.